Examine individual changes

This page allows you to examine the variables generated by the Edit Filter for an individual change.

Variables generated for this change

VariableValue
Edit count of the user ($1) (user_editcount)
null
Name of the user account ($1) (user_name)
'122.179.136.94'
Age of the user account ($1) (user_age)
0
Groups (including implicit) the user is in ($1) (user_groups)
[ 0 => '*' ]
Rights that the user has ($1) (user_rights)
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Whether or not a user is editing through the mobile interface ($1) (user_mobile)
false
Whether the user is editing from mobile app ($1) (user_app)
false
Page ID ($1) (page_id)
7815577
Page namespace ($1) (page_namespace)
0
Page title without namespace ($1) (page_title)
'Automated optical inspection'
Full page title ($1) (page_prefixedtitle)
'Automated optical inspection'
Edit protection level of the page ($1) (page_restrictions_edit)
[]
Last ten users to contribute to the page ($1) (page_recent_contributors)
[ 0 => 'REDACTED403', 1 => '122.179.136.94', 2 => 'Citation bot', 3 => 'MrOllie', 4 => '49.228.8.210', 5 => '182.75.118.98', 6 => 'Ferien', 7 => '49.228.9.196', 8 => 'ClueBot NG', 9 => '122.160.62.157' ]
Page age in seconds ($1) (page_age)
550051515
Action ($1) (action)
'edit'
Edit summary/reason ($1) (summary)
'Add link'
Old content model ($1) (old_content_model)
'wikitext'
New content model ($1) (new_content_model)
'wikitext'
Old page wikitext, before the edit ($1) (old_wikitext)
'{{short description|System for visual inspection of printed circuit boards by a computerized system}} '''Automated optical inspection''' ('''AOI''') is an automated [[visual inspection]] of [[printed circuit board]] (PCB) (or [[LCD]], [[transistor]]) manufacture where a [[camera]] [[machine vision|autonomously scans]] the device under test for both [[catastrophic failure]] (e.g. missing component) and [[Product defect|quality defect]]s (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.<ref>{{Cite journal|url=https://www.academia.edu/25794300|title=3D Solder Joint Reconstruction on SMD based on 2D Images|first=Pedro|last=Vitoriano|access-date=4 December 2021|website=Academia.edu}}</ref> Historically, the primary place for AOI systems has been after solder re-flow or "post-production." Mainly because, post-re-flow AOI systems can inspect for most types of defects (component placement, solder shorts, missing solder, etc.) at one place in the line with one single system. In this way the faulty boards are reworked and the other boards are sent to the next process stage.<ref>{{Cite book|chapter-url=https://www.academia.edu/4616712|first1=Pedro M. A.|last1=Vitoriano|first2=Tito G.|last2=Amaral|first3=Octavio Pascoa|last3=Dias|title=2011 International Conference on Power Engineering, Energy and Electrical Drives |chapter=Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance |date=4 December 2011|pages=1–7 |doi=10.1109/PowerEng.2011.6036444 |isbn=978-1-4244-9845-1 |s2cid=24824082 |access-date=4 December 2021}}</ref> == SMT inspection == AOIs for a PCB board with components may inspect the following features: * Area defects * Billboarding * Component offset * Component polarity * Component presence or absence * Component Skew * Excessive Solder Joints * Flipped component * Height Defects * Insufficient Paste around Leads * Insufficient Solder Joints * Lifted Leads * No Population tests * Paste Registration * Severely Damaged Components * Tombstoning * Volume Defects * Wrong Part * Solder Bridging * Presence of Foreign Material on the board AOI can be used in the following locations in the [[Surface-mount technology|SMT]] lines: post paste, pre-reflow, post-reflow, or wave areas. == Bare PCB inspection == AOI for a bare PCB board inspection may detect these features: * Line width violations * Spacing violation * Excess copper * Missing pad – a feature that should be on the board is missing * Short circuits * Gold Finger damage * Cuts * Hole breakage – a drilled hole (via) is outside of its landing pad * Wrong mounting components identified The triggering of a defects report may be either rule-based (e.g. no lines on the board should be smaller than 50μ) or CAD based in which the board is locally compared with the intended design. This inspection is much more reliable and repeatable than manual visual inspection.{{Citation needed|date=June 2015}} In many cases, smaller circuit board designs are driving up the demand for AOI vs in-circuit testing.{{Citation needed|date=June 2015}} ==Related technologies== The following are related technologies and are also used in electronic production to test for the correct operation of electronics printed circuit boards:<ref>[http://www.zentroid.biz/ Zentroid] {{webarchive |url=https://web.archive.org/web/20130517004754/http://www.zentroid.biz/ |date=May 17, 2013 }} - PCB/CAD/AOI Basics, Component and Package names</ref> * [[Automated x-ray inspection]] (AXI) * [[Joint Test Action Group]] (JTAG) * [[In-circuit test]] (ICT) * [[Acceptance testing|Functional testing]] ==See also== *[[Object recognition]] *[[Machine vision]] *[[Automated X-ray inspection]] *[[Under vehicle inspection]] ==References== {{reflist}} [[Category:Hardware testing]][https://www.pcbdirectory.com/equipment/search/automated-optical-inspection-equipment 4. Automated Optical Inspection (AOI) Equipment List] [[Category:Applications of computer vision]] [[Category:Printed circuit board manufacturing]] [[Category:Nondestructive testing]]'
New page wikitext, after the edit ($1) (new_wikitext)
'{{short description|System for visual inspection of printed circuit boards by a computerized system}} '''[https://www.einnosys.com/eiaoi/ Automated optical inspection]''' ('''AOI''') is an automated [[visual inspection]] of [[printed circuit board]] (PCB) (or [[LCD]], [[transistor]]) manufacture where a [[camera]] [[machine vision|autonomously scans]] the device under test for both [[catastrophic failure]] (e.g. missing component) and [[Product defect|quality defect]]s (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.<ref>{{Cite journal|url=https://www.academia.edu/25794300|title=3D Solder Joint Reconstruction on SMD based on 2D Images|first=Pedro|last=Vitoriano|access-date=4 December 2021|website=Academia.edu}}</ref> Historically, the primary place for AOI systems has been after solder re-flow or "post-production." Mainly because, post-re-flow AOI systems can inspect for most types of defects (component placement, solder shorts, missing solder, etc.) at one place in the line with one single system. In this way the faulty boards are reworked and the other boards are sent to the next process stage.<ref>{{Cite book|chapter-url=https://www.academia.edu/4616712|first1=Pedro M. A.|last1=Vitoriano|first2=Tito G.|last2=Amaral|first3=Octavio Pascoa|last3=Dias|title=2011 International Conference on Power Engineering, Energy and Electrical Drives |chapter=Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance |date=4 December 2011|pages=1–7 |doi=10.1109/PowerEng.2011.6036444 |isbn=978-1-4244-9845-1 |s2cid=24824082 |access-date=4 December 2021}}</ref> == SMT inspection == AOIs for a PCB board with components may inspect the following features: * Area defects * Billboarding * Component offset * Component polarity * Component presence or absence * Component Skew * Excessive Solder Joints * Flipped component * Height Defects * Insufficient Paste around Leads * Insufficient Solder Joints * Lifted Leads * No Population tests * Paste Registration * Severely Damaged Components * Tombstoning * Volume Defects * Wrong Part * Solder Bridging * Presence of Foreign Material on the board AOI can be used in the following locations in the [[Surface-mount technology|SMT]] lines: post paste, pre-reflow, post-reflow, or wave areas. == Bare PCB inspection == AOI for a bare PCB board inspection may detect these features: * Line width violations * Spacing violation * Excess copper * Missing pad – a feature that should be on the board is missing * Short circuits * Gold Finger damage * Cuts * Hole breakage – a drilled hole (via) is outside of its landing pad * Wrong mounting components identified The triggering of a defects report may be either rule-based (e.g. no lines on the board should be smaller than 50μ) or CAD based in which the board is locally compared with the intended design. This inspection is much more reliable and repeatable than manual visual inspection.{{Citation needed|date=June 2015}} In many cases, smaller circuit board designs are driving up the demand for AOI vs in-circuit testing.{{Citation needed|date=June 2015}} ==Related technologies== The following are related technologies and are also used in electronic production to test for the correct operation of electronics printed circuit boards:<ref>[http://www.zentroid.biz/ Zentroid] {{webarchive |url=https://web.archive.org/web/20130517004754/http://www.zentroid.biz/ |date=May 17, 2013 }} - PCB/CAD/AOI Basics, Component and Package names</ref> * [[Automated x-ray inspection]] (AXI) * [[Joint Test Action Group]] (JTAG) * [[In-circuit test]] (ICT) * [[Acceptance testing|Functional testing]] ==See also== *[[Object recognition]] *[[Machine vision]] *[[Automated X-ray inspection]] *[[Under vehicle inspection]] ==References== {{reflist}} [[Category:Hardware testing]][https://www.pcbdirectory.com/equipment/search/automated-optical-inspection-equipment 4. Automated Optical Inspection (AOI) Equipment List] [[Category:Applications of computer vision]] [[Category:Printed circuit board manufacturing]] [[Category:Nondestructive testing]]'
Unified diff of changes made by edit ($1) (edit_diff)
'@@ -1,4 +1,4 @@ {{short description|System for visual inspection of printed circuit boards by a computerized system}} -'''Automated optical inspection''' ('''AOI''') is an automated [[visual inspection]] of [[printed circuit board]] (PCB) (or [[LCD]], [[transistor]]) manufacture where a [[camera]] [[machine vision|autonomously scans]] the device under test for both [[catastrophic failure]] (e.g. missing component) and [[Product defect|quality defect]]s (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.<ref>{{Cite journal|url=https://www.academia.edu/25794300|title=3D Solder Joint Reconstruction on SMD based on 2D Images|first=Pedro|last=Vitoriano|access-date=4 December 2021|website=Academia.edu}}</ref> +'''[https://www.einnosys.com/eiaoi/ Automated optical inspection]''' ('''AOI''') is an automated [[visual inspection]] of [[printed circuit board]] (PCB) (or [[LCD]], [[transistor]]) manufacture where a [[camera]] [[machine vision|autonomously scans]] the device under test for both [[catastrophic failure]] (e.g. missing component) and [[Product defect|quality defect]]s (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.<ref>{{Cite journal|url=https://www.academia.edu/25794300|title=3D Solder Joint Reconstruction on SMD based on 2D Images|first=Pedro|last=Vitoriano|access-date=4 December 2021|website=Academia.edu}}</ref> Historically, the primary place for AOI systems has been after solder re-flow or "post-production." Mainly because, post-re-flow AOI systems can inspect for most types of defects (component placement, solder shorts, missing solder, etc.) at one place in the line with one single system. In this way the faulty boards are reworked and the other boards are sent to the next process stage.<ref>{{Cite book|chapter-url=https://www.academia.edu/4616712|first1=Pedro M. A.|last1=Vitoriano|first2=Tito G.|last2=Amaral|first3=Octavio Pascoa|last3=Dias|title=2011 International Conference on Power Engineering, Energy and Electrical Drives |chapter=Automatic Optical Inspection for Surface Mounting Devices with IPC-A-610D compliance |date=4 December 2011|pages=1–7 |doi=10.1109/PowerEng.2011.6036444 |isbn=978-1-4244-9845-1 |s2cid=24824082 |access-date=4 December 2021}}</ref> '
New page size ($1) (new_size)
4357
Old page size ($1) (old_size)
4323
Size change in edit ($1) (edit_delta)
34
Lines added in edit ($1) (added_lines)
[ 0 => ''''[https://www.einnosys.com/eiaoi/ Automated optical inspection]''' ('''AOI''') is an automated [[visual inspection]] of [[printed circuit board]] (PCB) (or [[LCD]], [[transistor]]) manufacture where a [[camera]] [[machine vision|autonomously scans]] the device under test for both [[catastrophic failure]] (e.g. missing component) and [[Product defect|quality defect]]s (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.<ref>{{Cite journal|url=https://www.academia.edu/25794300|title=3D Solder Joint Reconstruction on SMD based on 2D Images|first=Pedro|last=Vitoriano|access-date=4 December 2021|website=Academia.edu}}</ref>' ]
Lines removed in edit ($1) (removed_lines)
[ 0 => ''''Automated optical inspection''' ('''AOI''') is an automated [[visual inspection]] of [[printed circuit board]] (PCB) (or [[LCD]], [[transistor]]) manufacture where a [[camera]] [[machine vision|autonomously scans]] the device under test for both [[catastrophic failure]] (e.g. missing component) and [[Product defect|quality defect]]s (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.<ref>{{Cite journal|url=https://www.academia.edu/25794300|title=3D Solder Joint Reconstruction on SMD based on 2D Images|first=Pedro|last=Vitoriano|access-date=4 December 2021|website=Academia.edu}}</ref>' ]
Whether or not the change was made through a Tor exit node (tor_exit_node)
false
Unix timestamp of change ($1) (timestamp)
'1712921442'